Isolation: Design and Testbed Evaluation” was published by researchers at Arizona State University and Intel Corporation.

A new technical paper titled “Digital Twin Technologies for Vehicular Prototyping: A Survey” was published by researchers at ...

A new technical paper titled “Impact of Sn Particle-Induced Mask Diffraction on EUV Lithography Performance Across Different ...

A new technical paper titled “An Investigation of Minimum Supply Voltage of 5nm SRAM from 300K down to 10K” was published by ...

Complexity, uncertainty, and lots of moving pieces will challenge the semiconductor industry for years to come.

EDA software is revolutionizing high-speed digital design by accelerating time-to-market despite growing complexity.

TSMC's technology roadmap; Intel cuts; reciprocal hacking; McKinsey on IC challenges, ML algorithm table; subsystem chiplets; ...

EDA vendors are taking aim at new ways to improve the productivity of design and verification engineers, who are struggling ...

Data sharing becomes more challenging when AI and multi-die assemblies are involved.

Predictive modeling, strategic sampling and embedded monitors help accelerate testing for yield limiting defects.

A NoC provides a structured and scalable approach to transporting data between the growing number of IP blocks in a chip.

A new technical paper titled “Hardware-based Heterogeneous Memory Management for Large Language Model Inference” was ...