The Fairchild MicroFET 2×2 dual is a 2mm x 2mm package based on Molded Leadless Packaging (MLP) technology. This technology is often used for power-related products due to its low package height and ...
San Jose, Calif. — Fairchild Semiconductor has introduced the FDMJ1023PZ andthe FDFMJ2P023Z MicroFET power switches for low power (less than 30 V) applications such as charging, asynchronous DC/DC and ...
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