Indium Corporation announces the Heat-Spring®metallic thermal interface material (TIM) specifically designed and optimized for use with Infineon Technologies AG PrimePACKTMIGBT modules. Many ...
As a developer of innovative materials solutions for critical radio frequency (RF)/microwave applications, Indium Corporation ...
Indium Corporation ® is proud to introduce new, high-reliability Au-based Precision Die-Attach (PDA) Preforms. Compared to standard preforms, these gold-based PDA preforms offer a higher level of ...
Some results have been hidden because they may be inaccessible to you
Show inaccessible results