LG Innotek to participate in ECTC for the first time in 2026, joining 135 leading global semiconductor companies; To exhibit ...

Samsung Electro-Mechanics (Semco) has announced the development of FC-BGA substrates for advanced driver assistance systems (ADAS), as well as the expansion of its high-end automotive semiconductor ...

The chip industry is racing to develop glass for advanced packaging, setting the stage for one of the biggest shifts in chip materials in decades — and one that will introduce a broad new set of ...

TOKYO--(BUSINESS WIRE)--Dai Nippon Printing Co., Ltd. (DNP, TOKYO: 7912) has developed a Glass Core Substrate (GCS) targeting next-generation semiconductor packages. The new product replaces ...

LG Innotek has entered the glass substrate business, which is regarded as a "game changer" in next-generation semiconductor packaging. The company plans to strengthen its competitiveness in the glass ...

Samsung Electro-Mechanics is making an investment of 1.8 trillion Korean won in Vietnam to expand production capacity for next-generation semiconductor substrates. According to the Vietnamese ...