SlimCell(TM) ECP System's Individual-Cell Chemistry Enables Industry's First Multi-Step Copper Plating Capability for 65nm and Beyond Copper Chips Applied Materials, Inc. introduces its 300mm SlimCell ...

The evolution of metallization paste and its impact on cell technology development was a key topic at PV CellTech 2018. During the conference, we caught up with Guangyao Jin, chief scientist, DuPont ...

Copper plating has been extensively employed in the fabrication of embedded packaging to reach high-density, high-speed, high performance electronic products. With through holes (TH) as well as blind ...

An alternative to silver paste: Copper plating is widely used both in the semiconductor industry and for bifacial and multi-junction PV cell designs. However, despite technical and cost advantages it ...

A reduction of silver consumption in PV production is required on the way to terawatt scale. Given this, the time may have come for the commercialization of new copper plating technologies – doing ...

San Jose, California – October 20, 2009 – Novellus Systems (NASDAQ: NVLS) today introduced the SABRE Excel, an advanced copper electroplating system designed to provide industry-leading fill and ...

SAN JOSE–Enabling a new round of copper-based devices, Novellus Systems Inc. today (December 1, 2003) rolled out its next-generation electrochemical plating (ECP) tool for use in 65- and 45-nm chip ...

Electroplating intermediates refer to a class of fine chemicals used as electroplating additives. Unlike the salt used in the plating production process, the electroplating intermediate is an additive ...

The UNSW researchers used copper plating on the front grid of TOPCon cells to reduce performance losses linked to contaminants. Image: UNSW/Solar Energy Materials and Solar Cells, CC BY 4.0.

Cyclic voltammetric stripping (CVS) analysis can be used to facilitate the detection of mercaptopropylsulfonic acid (MPS). MPS is the breakdown product of bis ...